Beryllium Copper 2% (CUBE)

Description:

• High thermal conductivity;
• Usinagem easy, free of porosities;
• Already hardened, dispensing grain microstructure thermal treatment allows excellent polishability;
• Excellent corrosion resistance, Welding possibility;
• Allows surface treatment;
• Design freedom, effective cooling, productivity, quality of plastic parts;
• high mechanical resistance. Reduces production time optimizing the use of injection molding machines.

Application:

• cavity of the metal molds;
• Molds.

Chemical properties:

Material Percent (Average)

CU 98,2 %
BE 1,8 %

Physical and Mechanical Properties:

•Toughness (Rockwell): 30 a 40 HRC
• Conductivity: 28 a 30 % IACS